Chip on film package including a protection layer and display device including the chip on film package
Number of patents in Portfolio can not be more than 2000
United States of America
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Dec 14, 2021
Grant Date -
Oct 17, 2019
app pub date -
Apr 16, 2019
filing date -
Apr 16, 2019
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A chip on film package includes: a base substrate having an output pad region; a plurality of output pads disposed in the output pad region of the base substrate, wherein the output pads are arranged in a zigzag configuration on the base substrate; a plurality of output pad wirings connected to the output pads, respectively; and a protection layer disposed on the output pad wirings. The protection layer is disposed on the output pad wirings disposed between two adjacent output pads, arranged in a first direction.
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