Manufacturing method of heat dissipation component

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United States of America Patent

PATENT NO 11183442
APP PUB NO 20210005530A1
SERIAL NO

16551742

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The invention provides a manufacturing method of a heat dissipation component. A substrate is provided. The substrate has an outer surface. A patterned dry film is formed on the outer surface. The patterned dry film is composed of a plurality of microporous patterns. A thermally conductive layer is formed on a region excluding the microporous patterns on the outer surface. The patterned dry film is removed to form a plurality of micro meshes. The thermally conductive layer surrounds the micro meshes.

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Patent Owner(s)

  • COMPEQ MANUFACTURING CO., LTD.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Lee, Hung-Yi Taoyuan, TW 9 31
Wu, Sz-Shian Taoyuan, TW 1 0

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