Heat treatment unit, cooling unit and cooling treatment method
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United States of America Patent
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Oct 8, 2002
Grant Date -
N/A
app pub date -
Nov 16, 2000
filing date -
Nov 18, 1999
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A substrate cooling unit comprises a cooling plate on which the substrate is placed, a cooling temperature adjusting element which adjusts the cooling plate to a predetermined temperature, a temperature controller which controls a temperature of the cooling temperature adjusting element according to a transfer function, a temperature sensor attached to the cooling plate, and a control parameter changing section which changes at least any one setting of a proportional operation coefficient, integral time or derivative time among control parameters in the transfer function based on a temperature of the cooling plate detected by the temperature sensor after the substrate that is an object to be cooled is placed on the cooling plate.
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