E-chuck for automated clamped force adjustment and calibration
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United States of America Patent
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Dec 14, 2010
Grant Date -
Sep 30, 2010
app pub date -
Mar 26, 2009
filing date -
Mar 26, 2009
priority date (Note) -
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status (Latency Note)
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Abstract
The present disclosure provides a semiconductor manufacturing method. The method includes performing a first process to a wafer; measuring the wafer for wafer data after the first process; securing the wafer on an E-chuck in a processing chamber; collecting sensor data from a sensor embedded in the E-chuck; adjusting clamping forces to the E-chuck based on the wafer data and the sensor data; and thereafter performing a second process to the wafer secured on the E-chuck in the processing chamber.
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