Method for manufacturing rigid-flexible printed circuit board
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United States of America Patent
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Nov 26, 2013
Grant Date -
Apr 26, 2012
app pub date -
Aug 11, 2011
filing date -
Oct 20, 2010
priority date (Note) -
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Abstract
A method for manufacturing a rigid-flexible printed circuit board includes certain steps. A flexible substrate including an exposed portion and an attaching portion is provided. An adhesive sheet defining an opening, and a rigid copper clad laminate are provided. The rigid copper clad laminate includes an insulating layer and a copper layer. A blind first slit is defined in the insulating layer. The flexible substrate, the adhesive sheet and the copper clad laminate are laminated. An outer circuit is formed in the copper layer. A second slit is defined in the copper clad laminate, and the second slit is in communication with the first slit. A portion of the copper clad laminate is removed to expose the flexible portion of the flexible substrate.
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