Modular high frequency integrated circuit structure
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United States of America Patent
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Jul 10, 2001
Grant Date -
N/A
app pub date -
Jun 11, 1999
filing date -
Aug 13, 1998
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Disclosed is a manufacturable silicon-based modular integrated circuit structure having performance characteristics comparable to high frequency GaAs-based integrated circuit structures, comprising materials and made in process steps which are compatible with existing low cost silicon-based integrated circuit processing.
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