Stepped package for image sensor and method of making same
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United States of America Patent
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Apr 28, 2015
Grant Date -
Mar 7, 2013
app pub date -
Sep 2, 2011
filing date -
Sep 2, 2011
priority date (Note) -
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status (Latency Note)
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Abstract
An image sensor package includes a crystalline handler having opposing first and second surfaces, and a cavity formed into the first surface. At least one step extends from a sidewall of the cavity, wherein the cavity terminates in an aperture at the second surface. A cover is mounted to the second surface and extends over and covers the aperture. The cover is optically transparent to at least one range of light wavelengths. A sensor chip is disposed in the cavity and mounted to the at least one step. The sensor chip includes a substrate with front and back opposing surfaces, a plurality of photo detectors formed at the front surface, and a plurality of contact pads formed at the front surface which are electrically coupled to the photo detectors.
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