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• 15 United States
• 10 France
• 8 Japan
• 7 China
• 5 Korea
• 2 Other

Patent Owner(s)

• TOKYO ELECTRON LIMITED

International Classification(s)

• C23C:COATING METALLIC MATERIAL; COATING MATERIAL WITH M....
• H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....
• C23F:NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM S....

• [Classification Symbol]

• [Patents Count]

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
Kato, Takehiro	Nirasaki, JP	23	121
Kodashima, Akira	Nirasaki, JP	5	22
Miyano, Shinichi	Nirasaki, JP	8	30

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Maintenance Fees

Fee	Large entity fee	small entity fee	micro entity fee	due date

Fee	Large entity fee	small entity fee	micro entity fee
Surcharge after expiration - Late payment is unavoidable	$700.00	$350.00	$175.00
Surcharge after expiration - Late payment is unintentional	$1,640.00	$820.00	$410.00

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
February 08, 2011	US,7883579,B2   US7883579B2	GRANTED PATENT AS SECOND PUBLICATION
June 14, 2007	US,20070131167,A1   US20070131167A1	FIRST PUBLISHED PATENT APPLICATION

Full Text

US Patent No: 7883579

Substrate processing apparatus and lid supporting apparatus for the substrate processing apparatus

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