Chip and manufacturing method and application thereof
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United States of America Patent
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Mar 17, 2009
Issued Date -
N/A
app pub date -
Sep 8, 2006
filing date -
Jul 18, 2006
priority date (Note) -
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Abstract
The present invention provides a chip and its manufacturing methods and applications. Regarding the chip, there are several solder bumps on the backside of the chip. The difference of the invented chip from the convention chips is that the solder bumps are embedded in an insulting layer and a thermal-plastic material layer of the invented chip backside and separated by a conductive layer from the insulting layer and thermal-plastic material layer. Additionally, there are some end members in the insulting layer, and the end member corresponds to one solder bump. Through the present invention, chips with different functions can be integrated together, so that the needs for having portable communication devices lighter and smaller would be met.
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