High density multi-pin connector with solder points

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 5967797
SERIAL NO

08977414

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A land grid array (LGA) includes a base having a first surface and a second surface which is substantially parallel thereto. The base is formed with a plurality of apertures which open through the base, and a plurality of electrical connectors are mounted on the base. Specifically, the connectors are formed with a central portion, and each connector has one deflectable finger and one extension which project in opposite directions from this central portion. The central portion of the connector is embedded into the base to cantilever the finger and the extension into respective juxtaposed apertures. When not deflected, the finger of the connector projects outwardly from its aperture and beyond the first surface of the base, while the extension is formed with a solder point surface which is generally coplanar with the second surface of the base. In a plurality of apertures, one finger projects one way and another finger projects the other way. With this combination, the electrical contact tips of the fingers are arranged as two matrices, one over the first surface of the base and the other over the second surface. Thus, a plurality of circuits are established between the first surface of the array and the second surface.

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Patent Owner(s)

  • TELEDYNE INDUSTRIES, INC.

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Maldonado, Ralph Temecula, CA 9 150

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