Apparatus for testing devices
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United States of America Patent
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Nov 30, 2010
Issued Date -
N/A
app pub date -
Sep 28, 2007
filing date -
Dec 21, 2005
priority date (Note) -
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Abstract
Methods and apparatus for testing semiconductor devices are provided herein. In some embodiments, an assembly for testing semiconductor devices can include a probe card assembly; and a thermal barrier disposed proximate an upper surface of the probe card assembly, the thermal barrier can restrict thermal transfer between tester side boundary conditions and portions of the probe card assembly disposed beneath the thermal barrier.
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