Configured-hole high-speed drilling system for micro-via pattern formation, and resulting structure

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United States of America Patent

PATENT NO 6624382
SERIAL NO

09882731

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Economical production of configured, laser-drilled, high-precision, ultra-miniature multiple-via-hole patterns is accomplished by multiplexing the homogenized, shaped, nearly-collimated output of one or more high-power excimer lasers into a set of beamlines, differently configured at different depths through the thickness of the substrate. A substrate delivery subsystem provides a continuous supply of film substrate strips or segments, which may be blanks or intermediates. Various stencils in a mask provide a cup-shaped partial hole, which is subsequently provided with a mating stem hole. Each stem portion of each hole is laser-drilled into the bottom of the cup portion from either above or below to form a via-hole with a desired configuration, such as stem-glass (or cup/funnel), as desired for multi-micro-via-hole arrays for filtering or for forming clog-resistant aerosol nozzles. Parameter changes of one or both of duration and focus may substitute for changes of mask to effect the changes in cup configuration as contrasted to stem configuration.

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Patent Owner(s)

  • ANVIK CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kling, Carl C Cos Cob, CT 13 154

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