Printed wiring board and method for manufacturing the same
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United States of America Patent
Stats
-
Aug 15, 2023
Grant Date -
N/A
app pub date -
Feb 17, 2022
filing date -
Sep 25, 2019
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A printed wiring board includes a base insulating layer, a conductor layer formed on the base layer and including conductor pads, an underlayer formed on one of the conductor pads and including a metal different from a metal of the conductor layer, a solder resist layer formed on the base layer such that the solder resist layer is covering the conductor layer and has openings exposing the conductor pads, and a bump formed directly on a first conductor pad of the conductor pads and including a base plating layer formed in a first opening of the openings and a top plating layer formed on the base plating layer such that a metal of the base plating layer is same as the metal of the conductor layer. The conductor pads include a second conductor pad such that the second conductor pad is the one of the conductor pads having the underlayer.
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