Leadframe spacer for double-sided power module

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United States of America Patent

PATENT NO 11830784
SERIAL NO

17447011

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Abstract

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A semiconductor device module may include a leadframe spacer that provides the functions of both a leadframe and a spacer, while enabling a double-sided cooling configuration. Such a leadframe spacer may include a leadframe surface that provides a die attach pad (DAP) that is shared by at least two semiconductor devices. The leadframe spacer may include at least one downset, where the semiconductor devices may be attached within a recess defined by the at least one downset. A first substrate may be connected to a first side of the leadframe. A second substrate may be connected to downset surfaces of the at least one downset, and positioned for further connection to the semiconductor devices in a double-sided assembly.

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Patent Owner(s)

  • SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Liangbiao Scarborough, US 10 5
Cheng, Tzu-Hsuan Scarborough, US 8 20
Liu, Yong Cumberland Foreside, US 1104 23132

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