Importance

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Abstract

The present invention provides a system, method and apparatus for testing multiple semiconductor wafers. The method includes the steps of attaching two or more wafer-interposer assemblies to a testing apparatus and testing each semiconductor die. Each wafer-interposer assembly comprises an interposer connected to one of the semiconductor wafers and each semiconductor wafer includes one or more semiconductor die. The present invention also provides a test fixture rack having a test fixture backbone, two or more wafer-interposer connectors attached to the test fixture backbone, and one or more connectors attached to the test fixture backbone and electrically coupled to the two or more wafer-interposer connectors such that each semiconductor die can be addressed and tested using the one or more connectors. Each wafer-interposer connector is designed to receive a wafer-interposer assembly having an interposer connected to one of the semiconductor wafers. Each semiconductor wafer includes one or more semiconductor die. In addition, the present invention provides a test fixture bank having a test fixture bank backbone, one or more connectors attached to the test fixture backbone for receiving one or more test fixture racks, and one or more test set connectors attached to the test fixture bank backbone and electrically coupled to the one or more connectors such that each semiconductor die can be addressed and tested using the one or more test set connectors. The present invention also provides a system for testing two or more semiconductor wafers wherein a testing device is connected to one or more test fixture racks or one or more test fixture banks.

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First Claim