Method and apparatus for mounting a DUT on a test board without use of socket or solder

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United States of America Patent

PATENT NO 11350525
APP PUB NO 20210360787A1
SERIAL NO

16877405

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Importance

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Abstract

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A method is provided for mounting a semiconductor IC to a substrate without a socket or solder. The method includes disposing a guide structure on the substrate. The substrate has multiple contact pads disposed thereon. The substrate also has multiple nuts formed therein for connecting to one or more bolts. The method also includes placing the semiconductor IC inside the guide structure such that the semiconductor IC makes contact with the contact pads. A top plate is disposed on the semiconductor IC. Further, the top plate and the semiconductor IC are fastened to the substrate.

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Patent Owner(s)

  • NUVOTON TECHNOLOGY CORPORATION

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Wilson, Simon San Jose, US 23 444

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