Micro-electro-mechanical device and manufacturing method for the same
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United States of America Patent
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Oct 8, 2013
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app pub date -
Nov 2, 2011
filing date -
Sep 6, 2005
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Abstract
It is an object of the present invention to provide a micro-electro-mechanical-device having a microstructure and a semiconductor element over one surface. In particular, it is an object of the present invention to provide a method for simplifying the process of forming the microstructure and the semiconductor element over one surface. A space in which the microstructure is moved, that is, a movable space for the microstructure is formed by processsing an insulating layer which is formed in a process of forming the semiconductor element. The movable space can be formed by forming the insulating layer having a plurality of openings and making the openings face each other to be overlapped each other.
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