Method for manufacturing multi-layer printed circuit board
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United States of America Patent
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Apr 15, 2008
Grant Date -
Aug 25, 2005
app pub date -
Apr 28, 2005
filing date -
Apr 4, 2003
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A multi-layer printed circuit board includes an insulation substrate; a surface conductive pattern disposed on a surface of the insulation substrate; and an inner conductive pattern embedded in the insulation substrate. The surface conductive pattern has a surface roughness on an insulation substrate side, the surface roughness of the surface conductive pattern being larger than that of the inner conductive pattern.
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