WIREBONDED MICROELECTRONIC PACKAGES INCLUDING HEAT DISSIPATION DEVICES FOR HEAT REMOVAL FROM ACTIVE SURFACES THEREOF
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United States of America Patent
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-
Mar 18, 2003
Grant Date -
Apr 10, 2003
app pub date -
Oct 4, 2001
filing date -
Oct 4, 2001
priority date (Note) -
Granted
status (Latency Note)
Importance
Abstract
A wirebonded microelectronic package including a microelectronic die attached by a back surface to a mounting surface of a recess formed in a substrate and a heat dissipation device thermally contacting said microelectronic die active surface. A plurality of bond wires electrically connects bond pads on the microelectronic die active surface to a plurality of corresponding traces within the recess.
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