Method of manufacturing a wiring substrate
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United States of America Patent
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May 1, 2012
Grant Date -
Sep 3, 2009
app pub date -
Mar 2, 2009
filing date -
Mar 3, 2008
priority date (Note) -
In Force
status (Latency Note)
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Abstract
There is provided a wiring substrate manufacturing method. The wiring substrate includes: a plurality of conductor patterns formed on a mounting surface on which an electronic component is to be mounted, wherein each of the conductor patterns is covered with a corresponding one of solder layers; and partition walls made of insulating material and formed along the conductor patterns on the mounting surface such that each of the partition walls is provided between the adjacent conductor patterns with a clearance interposed therebetween.
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