Fabrication process for embedding optical band gap structures in a low temperature co-fired ceramic substrate
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United States of America Patent
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Apr 3, 2007
Grant Date -
Jul 21, 2005
app pub date -
Jan 20, 2004
filing date -
Jan 20, 2004
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Abstract
A method for embedding optical band gap (OBG) devices in a ceramic substrate (100). The method includes the step (320) of pre-forming an OBG structure (105). The OBG structure can be a micro optical electromechanical systems (MOEMS) device. Further, the OBG structure can be preformed from indium phosphide and/or indium gallium arsenide. The method also includes the step (325) of coating the OBG structure with a surface binding material (230). The surface binding material can be comprised of calcium and hexane. The ratio of the calcium to hexane can be from about 1% to 2%. At a next step (330), the OBG structure can be inserted into the ceramic substrate. A pre-fire step (335) and a sintering step (340) then can be performed on the substrate.
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