Mounting substrate and its production method, and printed wiring board having connector function and its connection method
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United States of America Patent
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-
May 28, 1991
Grant Date -
N/A
app pub date -
May 25, 1989
filing date -
Aug 31, 1988
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
This invention relates to a mounting substrate onto which components such as an IC chip are to be mounted, its production method, and a printed wiring board having a connector function suitable for a fine pitch and its connection method. Metal nodules are formed on conductors of connection portions by electrodeposition, or the like. Connection is made by fixing connection portions by an adhesive. Good conduction can be secured through the metal nodules and good insulation can be held between adjacent conductors.
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Cited Art Landscape
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