Industrial microdeposition system for polymer light emitting diode displays, printed circuit boards and the like
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United States of America Patent
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Sep 18, 2007
Grant Date -
Dec 30, 2004
app pub date -
May 31, 2002
filing date -
Jun 1, 2001
priority date (Note) -
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status (Latency Note)
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Abstract
A microdeposition system (20) and method deposits precise amounts of fluid material onto a substrate. A microdeposition head (50) includes a plurality of spaced nozzles. A positioning device controls a position of the microdeposition head relative to the substrate. A controller (22) includes a positioning module that communicates with the positioning device and that generates position control signals for the positioning device. A nozzle firing module communicates with the microdeposition head (50) and selectively generates nozzle firing commands to define features of at least one layer of an electrical device, such as resistors, traces and capacitors on a printed circuit board, polymer light emitting diodes, and light panels.
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