Structure and method for latchup improvement using through wafer via latchup guard ring

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United States of America Patent

PATENT NO 8390074
APP PUB NO 20110227166A1
SERIAL NO

13150437

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Abstract

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A structure for preventing latchup. The structure includes a latchup sensitive structure and a through wafer via structure bounding the latch-up sensitive structure to prevent parasitic carriers from being injected into the latch-up sensitive structure.

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Patent Owner(s)

  • GLOBALFOUNDRIES INC.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Voldman, Steven H South Burlington, US 229 3649

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