Method of forming a VDF oligomer or co-oligomer film on a substrate and an electrical device comprising the VDF oligomer or co-oligomer film on the substrate
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United States of America Patent
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Jun 16, 2015
Grant Date -
Dec 13, 2012
app pub date -
Dec 23, 2009
filing date -
Dec 23, 2009
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Abstract
A method of forming a vinylidene fluoride (VDF) oligomer or co-oligomer film on a substrate is disclosed. The method comprises forming a VDF oligomer or co-oligomer precursor solution; depositing the VDF oligomer or co-oligomer precursor solution onto the substrate to form a preliminary VDF oligomer or co-oligomer film on the substrate; and applying uniaxial pressure on the preliminary VDF oligomer or co-oligomer film and the substrate at an elevated temperature to form the VDF oligomer or co-oligomer film on the substrate. The substrate may comprise a metal surface which may be used as a bottom electrode and a top electrode may be deposited on the VDF oligomer or co-oligomer film. The VDF oligomer or co-oligomer film, the bottom electrode on the substrate and the top electrode on the VDF oligomer or co-oligomer film form an electrical device.
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