Fabricating photonics devices fully integrated into a CMOS manufacturing process

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United States of America Patent

PATENT NO 8633067
SERIAL NO

12951597

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Disclosed are process enhancements to fully integrate the processing of a photonics device into a CMOS manufacturing process flow. A CMOS wafer may be divided into different portions. One of the portions is for the CMOS devices and one or more other portions are for the photonics devices. The photonics devices include a ridged waveguide and a germanium photodetector. The germanium photodetector may utilize a seeded crystallization from melt process so there is more flexibility in the processing of the germanium photodetector.

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Patent Owner(s)

  • GLOBALFOUNDRIES INC.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Assefa, Solomon Ossining, US 96 1460
Green, William M J Astoria, US 12 97
Vlasov, Yurii A Katonah, US 71 1274
Yang, Min Yorktown Heights, US 295 3317

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