Memory card and method for devising
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United States of America Patent
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Oct 20, 2009
Grant Date -
Jul 12, 2007
app pub date -
Feb 1, 2007
filing date -
Jan 11, 2006
priority date (Note) -
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status (Latency Note)
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Abstract
The present invention provides a system and method for employing leaded packaged memory devices in memory cards. Leaded packaged ICs are disposed on one or both sides of a flex circuitry structure to create an IC-populated structure. In a preferred embodiment, leads of constituent leaded IC packages are configured to allowed the lower surface of the leaded IC packages to contact respective surfaces of the flex circuitry structure. Contacts for typical embodiments are supported by a rigid portion of the flex circuitry structure and the IC-populated structure is disposed in a casing to provide card structure for the module.
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