Three dimensional antenna array module

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 11901635
APP PUB NO 20220416442A1
SERIAL NO

17898706

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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An apparatus includes a plurality of antenna modules and a printed circuit board (PCB) having a plurality of holes embedded with a heat sink. Each antenna module includes an antenna substrate, a plurality of three-dimensional (3-D) antenna cells mounted on a first surface of the antenna substrate, and a plurality of packaged circuitry mounted on a second surface of the antenna substrate. The plurality of packaged circuitry are electrically connected with the plurality of 3-D antenna cells. Each of the plurality of antenna modules is mounted on a plurality of portions of the heat sink such that a corresponding packaged circuitry of the plurality of packaged circuitry is in a direct contact with the plurality of portions of the heat sink embedded within the plurality of holes.

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Patent Owner(s)

  • MOVANDI CORPORATION

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Besoli, Alfred Grau Irvine, US 64 516
Boers, Michael South Turramurra, AU 114 1135
De, Flaviis Franco Irvine, US 36 566
Gharavi, Sam Irvine, US 103 832
Rofougaran, Ahmadreza Newport Beach, US 628 10207
Rofougaran, Maryam Rancho Palos Verdes, US 418 9210
Shin, Donghyup Irvine, US 40 339
Shirinfar, Farid Granada Hills, US 97 815
Sridharan, Kartik San Diego, US 52 361
Wu, Stephen Fountain Valley, US 121 1378
Yoon, Seunghwan Irvine, US 158 1506

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