System and method for determining yield impact for semiconductor devices
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United States of America Patent
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Apr 2, 2002
Grant Date -
Mar 14, 2002
app pub date -
Jan 11, 1999
filing date -
Jan 11, 1999
priority date (Note) -
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Abstract
A method for determining yield impact of process steps for semiconductor wafers having a plurality of dies includes the steps of correlating defects on the dies to electrical failures on the dies to determine hits on the dies, computing kill rates for the dies based on hits for each inspection process, determining a number of dies to be killed by considering kill rates for the dies with hits to weight the defects of each die and determining a yield loss for each inspection process based on the number of dies to be killed and a total number of dies on the semiconductor wafer. A system is also included.
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