Molded electronic assembly
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United States of America Patent
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Dec 9, 2008
Grant Date -
Oct 21, 2004
app pub date -
Jan 20, 2004
filing date -
Jan 17, 2003
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A molded electronic assembly of the present invention includes a wiring harness with connectors connected thereto, and a molded body formed to encapsulate the wiring harness and provide access to the connectors. The molded may comprise a plastic material such as polyurethane or other moldable material. A conductive coating may be placed on the outer surface of the molded body to provide electrical shielding. Additionally, the wiring harness may be shielded with a wrapping of metallic tape or the like. The molded electronic assembly of the present invention may include a grounding fixture or grommet that provides mechanical properties of a structural fixture and allows for ground wires to be terminated.
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