Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 11476131
APP PUB NO 20190080936A1
SERIAL NO

16125060

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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There is provided a technique that includes: processing a substrate in a process vessel by supplying a processing gas to the substrate and exhausting the processing gas from an exhaust part including an exhaust pipe and a pump; cleaning an interior of the exhaust part by supplying a first cleaning gas from a supply port installed in the exhaust pipe directly into the exhaust pipe; and cleaning an interior of the process vessel by supplying a second cleaning gas into the process vessel, wherein a frequency of performing the act of cleaning the interior of the exhaust part is set higher than a frequency of performing the act of cleaning the interior of the process vessel.

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Patent Owner(s)

  • KOKUSAI ELECTRIC CORPORATION

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ozaki, Takashi Toyama, JP 131 3229

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