Integrated circuit (IC) with reconstituted die interposer for improved connectivity, and related methods of fabrication

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United States of America Patent

PATENT NO 11769732
SERIAL NO

17024214

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Abstract

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An integrated circuit (IC) with reconstituted die interposer for improved connectivity has at least one device or component mounted on an exterior upper surface that couples to a die in an interposer layer within the package. The interposer layer may have interconnect structures, where a first interconnect structure has vias of a first pitch and a second interconnect structure has vias of a second pitch greater than the first pitch. In this manner, the interposer layer acts as a device that can allow conductive coupling for other devices with those pitches to support interconnections between those devices and other devices within the interposer layer.

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Patent Owner(s)

  • QUALCOMM INCORPORATED

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kim, Jonghae San Diego, US 314 3445
Patil, Aniket San Diego, US 69 80

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