Circuit board including conductive structure for electrically connecting wires, and electronic device including same

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 11431830
APP PUB NO 20210044681A1
SERIAL NO

16977617

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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Disclosed are various embodiments relating to a circuit board included in an electronic device and, according to one embodiment, the circuit board can comprise: at least one wire included on the circuit board, at least one conductive structure arranged on the circuit board in order to reinforce the circuit board, and arranged in order to electrically connect the at least one wire; and at least one conductive member included on the circuit board, and electrically connecting the at least one wire with the at least one conductive structure, and additional other various embodiments are possible.

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First Claim

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Patent Owner(s)

  • SAMSUNG ELECTRONICS CO. LTD.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kang, Seunggoo Suwon-si, KR 20 71
Kim, Hyunseok Suwon-si, KR 89 358
Lee, Dongyup Suwon-si, KR 8 12
Lee, Hyangbok Suwon-si, KR 7 17
Lim, Hoyeong Suwon-si, KR 15 66
Park, Junghoon Suwon-si, KR 82 544
Son, Dongil Suwon-si, KR 91 401
Yi, Yongseung Suwon-si, KR 10 25

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