Microelectronic cooling apparatus and associated method
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Sep 14, 2010
Grant Date -
Apr 26, 2007
app pub date -
Oct 20, 2005
filing date -
Oct 20, 2005
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
An apparatus and associated method to provide localized cooling to a microelectronic device are generally described. In this regard, according to one example embodiment, a cooling apparatus comprising a heat spreader and one or more thermoelectric cooler(s) thermally coupled to the heat spreader provides cooling to one or more hot spot(s) of a microelectronic device, the one or more thermoelectric cooler(s) having a single heat exchanging element of a single material.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully