Semiconductor device, circuit substrate, electro-optic device and electronic appliance
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United States of America Patent
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Feb 15, 2011
Grant Date -
Oct 7, 2010
app pub date -
May 10, 2010
filing date -
Jun 14, 2004
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A semiconductor device in the first embodiment includes: an electrode pad and a resin projection, formed on an active surface; a conductive film deposited from a surface of the electrode pad to a surface of the resin projection; a resin bump formed with the resin projection and with the conductive film. The semiconductor device is conductively connected to the opposing substrate through the resin bump electrode. The testing electrode is formed with the conductive film that is extended and applied to the opposite side of the electrode pad across the resin projection.
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