Semiconductor die package including IC driver and bridge
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United States of America Patent
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-
Mar 29, 2011
Grant Date -
Sep 17, 2009
app pub date -
Mar 12, 2008
filing date -
Mar 12, 2008
priority date (Note) -
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status (Latency Note)
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Abstract
A semiconductor die package. Embodiments of the semiconductor die package are usable in backlight circuitry. Systems in packages may include a bridge circuit or a part thereof, and a integrated circuit die, such as a driver die, encapsulated by a molding material or other package. The bridge circuit may be stacked on opposing surfaces of a leadframe.
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