Communication system with multipoint circuit bonding
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United States of America Patent
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Apr 21, 2009
Grant Date -
N/A
app pub date -
Nov 18, 2003
filing date -
Nov 18, 2003
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A communication system comprises: a first circuit bonding device, a second circuit bonding device, a third circuit bonding device, first bonded circuits coupling the first circuit bonding system and the second circuit bonding system, second bonded circuits coupling the first circuit bonding system and the third circuit bonding system, and third bonded circuits coupling the second circuit bonding device and the third circuit bonding device.
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