Semiconductor package with heat dissipating structure
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United States of America Patent
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-
Mar 11, 2008
Grant Date -
Aug 26, 2004
app pub date -
Feb 25, 2004
filing date -
Dec 7, 2001
priority date (Note) -
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status (Latency Note)
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Abstract
A semiconductor package with a heat dissipating structure is provided. The heat dissipating structure includes a flat portion, and a plurality of support portions formed at edge corners of the flat portion for supporting the flat portion above a chip mounted on a substrate. The support portions are mounted at predetermined area on the substrate without interfering with arrangement of the chip and bonding wires that electrically connect the chip to the substrate. The support portions are arranged to form a space embraced by adjacent supports and the flat portion, so as to allow the bonding wires to pass through the space to reach area on the substrate outside coverage of the heat dissipating structure; besides, passive components or other electronic components can be mounted on the substrate at area within or outside the coverage of the heat dissipating structure, thereby improving flexibility in component arrangement in the semiconductor package.
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