Wafer handling tool and method of use
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United States of America Patent
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Apr 25, 1989
Grant Date -
N/A
app pub date -
Feb 8, 1988
filing date -
Feb 8, 1988
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An IC-wafer handling tool comprising an aluminum handle, a detachable polyimid pointed end member and a detachable polyimid hook end member. The pointed end is used in cooperation with a vacuum pick to load wafers into susceptor pockets, and the hooked end is used in cooperation with a vacuum pick to unload wafers. During loading and unloading, the only contact with the front side of the wafer is at the edge of the wafer, which does not contain integrated circuit structure, thereby decreasing particulate contamination of the wafer and the associated IC structure on the wafer.
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