Short-circuit probe card, wafer test system, and fault detection method for the wafer test system

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United States of America Patent

PATENT NO 11821919
SERIAL NO

16912021

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Abstract

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The present invention provides a short-circuit probe card, including: a substrate having an upper surface and a lower surface; a plurality of first contacts formed on the upper surface; and a plurality of second contacts formed on the lower surface and connected to the plurality of first contacts. The first contacts and second contacts are all grounded.

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Patent Owner(s)

  • WINDBOND ELECTRONICS CORP.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Yih-Chau Taichung, TW 2 2
Ho, Hsuan-Min Taichung, TW 1 0
Kan, Chung-Hsuan Hukou Township, TW 1 0
Lin, Shu-Chi Taichung, TW 6 7
Tsai, Yuan-Long Taichung, TW 1 0

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