Electronic chip with under-side power block
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United States of America Patent
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-
Dec 27, 2022
Grant Date -
Oct 31, 2019
app pub date -
Dec 30, 2016
filing date -
Dec 30, 2016
priority date (Note) -
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status (Latency Note)
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Abstract
An electronic chip, system, and method includes a power block including a power source configured to provide power to components of the electronic chip and a relay circuit coupled to the power source and a ground plane. The electronic chip further includes chip package having a first major side and a second major side, the power block secured to the second major side, the chip package comprising electrical connections, disposed on the second major side, to be secured with respect to a circuit board, and interconnect circuitry, electrically coupling the power block to ground, comprising a plurality of conductive layers, a conductive through hole, electrically connecting a first pair of the plurality of conductive layers, having a first width, and a via, electrically connecting a second pair of the plurality of conductive layers, having a second width less than the first width.
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