Leadframes with folded conductor portion and devices therefrom
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United States of America Patent
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-
Jan 31, 2023
Grant Date -
Sep 16, 2021
app pub date -
Mar 16, 2020
filing date -
Mar 16, 2020
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A leadframe includes leads or lead terminals, a plurality of folded features including i) support features positioned within an area defined in at least one dimension by the leads or the lead terminals configured for supporting at least one of a die pad and a first pad and a second pad spaced apart from one another, or ii) current carrying features. At least one of the folded features includes a planar portion and a folded edge structure that curves upwards at an angle of at least 45° relative to the planar portion. The folded features are configured to provide an effective increase in thickness to reduce the deformation observed in assembly.
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