Thermoplastic resin-coated metallic substrate and the method of producing the same through use of a polyamide adhesive layer
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United States of America Patent
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Jan 8, 1980
Issued Date -
N/A
app pub date -
Dec 1, 1975
filing date -
Feb 3, 1975
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A metallic substrate and an outer thermoplastic resinous coating are bonded to one another by a resinous polyamide hot melt adhesive prepared by condensation of an unpolymerized amide-forming dicarboxylic-containing compound or polymeric fatty acid with a diamine of the formula ##STR1## wherein each of R.sup.4, R.sup.5, R.sup.6 and R.sup.7 is a hydrogen atom or an alkyl radical; X is a nitrogen atom or a carbon atom bearing a single hydrogen substituent and n is an integer of from 1 to 6 inclusive. The adhesive is first applied to the metal substrate with sequential deposition of the thermoplastic resinous outer coating.
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