Mold die, method of manufacturing mold die, injection molding apparatus, and method of manufacturing mold product
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United States of America Patent
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Aug 1, 2023
Grant Date -
May 20, 2021
app pub date -
Oct 31, 2019
filing date -
Feb 20, 2019
priority date (Note) -
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status (Latency Note)
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Abstract
A mold cavity which is a mold die includes a die body and a plating layer provided on the surface of a mold surface. In this case, the mold surface has a leather-grain transfer surface for forming a grain pattern. The leather-grain transfer surface includes a first uneven-shape part and a second uneven-shape part formed at the surface of the first uneven-shape part and smaller in an uneven-shape width than the first uneven-shape part. The uneven-shape width falls within a range of 10 μm or more and less than 500 μm. The plating layer is an electroless-plating layer. A thickness of at least part of the plating layer falls within a range of 0.1 μm or more and less than 10 μm.
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