Wire fixation apparatus and soldering method

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 11471967
APP PUB NO 20200114447A1
SERIAL NO

16713185

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A fixation apparatus includes a base, a wire fixing device mounted on the base, and a pressing device mounted on the base. The wire fixing device positions and fixes a wire on a circuit board and includes a fixing frame mounted on the base and a moving unit received in a receiving chamber of the fixing frame. The fixing frame has a first positioning groove. The moving unit is movable between a clamping position and a release position and has a second positioning groove coupled with the first positioning groove. The wire is inserted into a wire insertion hole in the circuit board between the first positioning groove and the second positioning groove when the mobile unit is moved to the release position. The wire is clamped and fixed between the first positioning groove and the second positioning groove when the moving unit is moved to the clamping position.

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First Claim

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Patent Owner(s)

  • TYCO ELECTRONICS (SHANGHAI) CO. LTD.; MEASUREMENT SEPCIALTIES (CHINA) LTD.; SHENZHEN AMI TECHNOLOGY CO. LTD.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Cai, Qiyu Shenzhen, CN 1 0
Deng, Yingcong Shanghai, CN 54 66
Fu, Yanbing Shenzhen, CN 1 0
Lan, Yumin Shenzhen, CN 1 0
Liao, Wenzhao Shenzhen, CN 1 0
Liu, Yun Shanghai, CN 225 744
Rochette, Jeffrey Shenzhen, CN 1 0
Zeng, Qinglong Shenzhen, CN 39 57
Zhang, Dandan Shanghai, CN 113 182
Zhou, Yang Shenzhen, CN 282 1133

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