Methods for removal of organic materials
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United States of America Patent
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Sep 25, 2007
Grant Date -
Nov 30, 2006
app pub date -
Aug 2, 2006
filing date -
Apr 25, 2002
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The invention includes methods of forming capacitor structures and removing organic material. An organic material, such as a photoresist, is disposed on a substrate. The organic material is contacted with a chemical mechanical polishing pad and a polishing fluid to remove the organic material from the substrate. The polishing fluid can be essentially free of particles, and can be water.
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