Methods and apparatus for integrated circuit having multiple dies with at least one on chip capacitor
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United States of America Patent
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Mar 30, 2010
Grant Date -
Oct 18, 2007
app pub date -
Oct 31, 2006
filing date -
Apr 14, 2006
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Abstract
An integrated circuit comprises a plurality of layers including a first substrate with an on chip capacitor and a second substrate. In one embodiment, the second substrate has an on chip capacitor. The first and/or second substrate can include a sensor element, such as a magnetic sensor element.
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