Method and apparatus for attaching microelectronic substrates and support members
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United States of America Patent
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Nov 10, 2009
Grant Date -
Jan 25, 2007
app pub date -
Jun 30, 2006
filing date -
Apr 4, 2002
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A microelectronic package and method for forming such packages. In one embodiment, the package can be formed by providing a support member having a first surface, a second surface facing opposite the first surface, and a projection extending away from the first surface. A quantity of adhesive material can be applied to the projection to form an attachment structure, and the adhesive material can be connected to a microelectronic substrate with the attachment structure providing no electrically conductive link between the microelectronic substrate and the support member. The microelectronic substrate and the support member can then be electrically coupled, for example, with a wire bond. In one embodiment, the projection can be formed by disposing a first material on a support member while the first material is at least partially flowable, reducing the flowability of the first material, and disposing a second material (such as the adhesive) on the first material.
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