Integrated circuit package
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Apr 27, 2010
Grant Date -
May 7, 2009
app pub date -
Nov 6, 2007
filing date -
Nov 6, 2007
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
Integrated circuit (IC) packages are described. Each IC package includes a die having an exposed metallic layer deposited on its back surface. Solder joints are arranged to physically and electrically connect I/O pads on the active surface of the die with associated leads. A molding material encapsulates portions of the die, leadframe and solder joint connections while leaving the metallic layer exposed and uncovered by molding material.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully