Compliant and crosslinkable thermal interface materials
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United States of America Patent
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Nov 2, 2004
Issued Date -
N/A
app pub date -
May 27, 2003
filing date -
Jan 30, 2001
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Described is a compliant and crosslinkable thermal interface material of at least one silicone resin mixture, at least one wetting enhancer and at least one thermally conductive filler, and a method of making and using same; as well as a method of improving thermal conductivity of polymer and resin systems.
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